Wafer transfer system and method of using the same

Details Wafer transfer system and method of using the same Wafer transfer system and method of using the same

1997-07-08

1999-08-31

Codd, Bernard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118719, 118723E, 118723I, 118730, 20429825, 20429835, 414217, 414220, 414936, 414937, 414938, 414939, 414940, C23F 108

Patent

active

059449403

ABSTRACT:
A wafer transfer system is described for transferring a wafer while at substantially the same time another wafer is being processed. The wafer transfer system comprises, in one embodiment, a transfer chamber having a wafer transfer blade, a load lock chamber coupled to the transfer chamber, an atmospheric robot for loading and unloading the wafer into the load lock chamber, and a slider coupled to the wafer transfer blade for moving the wafer transfer blade between the transfer chamber and the load lock chamber. According to a preferred embodiment, the slider utilizes a magnetic coupling mechanism. In a further embodiment, a device comprising a transfer chamber coupled to a plurality of plasma sources capable of simultaneously or sequentially providing different plasma structures within the transfer chamber, is described.

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