Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1997-12-01
1999-12-28
Codd, Bernard
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
118723E, 118723I, 118716, 118730, 20429825, 20429835, 134 48, 134 50, 134 52, 134 61, 134 63, 134902, 414217, 414219, 414220, 414936, 414937, 414938, 414939, 414940, 438716, C23C 1600
Patent
active
060076755
ABSTRACT:
An apparatus and method are described for stripping the photoresist from a wafer while in a substantially parallel manner, another wafer is being transferred between a load lock chamber and a transfer chamber, where the processing occurs. Further, a system is described whereby two load lock chambers are employed so that processing of wafers can continue uninterrupted by a delay caused by the need to open, empty, reload and re-equilibrate a single load lock chamber. Still further, a system is described for performing multi-step dry-stripping applications requiring different conditions for two or more of the steps wherein the steps may be performed simultaneously or sequentially. Finally, a system combining a dry-stripping module and a wet-cleaning module is described which combination system permits the continuous, fully-automated dry-stripping and wet-cleaning of wafers and, upon completion of the entire processing cycle, returning wafers to their original wafer cassettes.
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patent: 5820679 (1998-10-01), Yokoyama et al.
patent: 5855681 (1999-01-01), Maydan et al.
patent: 5855726 (1999-01-01), Soraaka et al.
Codd Bernard
Gamma Precision Technology, Inc.
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