Wafer transfer system and method of using the same

Details Wafer transfer system and method of using the same Wafer transfer system and method of using the same

1996-07-09

1999-05-04

Codd, Bernard

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118723E, 118723I, 118730, 118719, 438711, 414220, 414936, 414938, 414939, 414940, H01L 213065, B65G 2508

Patent

active

059001054

ABSTRACT:
A wafer transfer system is described for transferring a wafer while at substantially the same time another wafer is being processed. The wafer transfer system comprises, in one embodiment, a transfer chamber having a wafer transfer blade, a load lock chamber coupled to the transfer chamber, an atmospheric robot for loading and unloading the wafer into the load lock chamber, and a slider coupled to the wafer transfer blade for moving the wafer transfer blade between the transfer chamber and the load lock chamber. According to a preferred embodiment, the slider utilizes a magnetic coupling mechanism and a plurality of plasma sources are coupled to the transfer chamber. The plurality of plasma sources are arranged in a plurality of pairs of plasma sources. Each plasma source in a pair of plasma sources share the other plasma source's induction coils.

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