Wafer transfer device and method

Details Wafer transfer device and method Wafer transfer device and method

1999-03-31

2001-02-20

Bratlie, Steven A. (Department: 3652)

Material or article handling

Apparatus for moving material between zones having different...

C414S222070, C414S222080, C414S222130, C414S226020, C414S939000, C414S941000, C294S106000

Reexamination Certificate

active

06190103

ABSTRACT:

BACKGROUND OF THE INVENTION
This invention relates to handling of substrates and, more particularly, to a load lock apparatus and methods for transferring substrates in semiconductor or flat panel manufacturing or the like.
Substrate handling apparatus such as load lock devices are commonly used for transferring substrates such as wafers or flat panels for carrying out various processes. As used herein, the term “substrate” refers to a wafer, flat panel, or the like. Multi-link mechanisms such as those disclosed in U.S. Pat. Nos. 5,292,303, 5,569,014, and 5,655,060 are commonly used in moving substrates. Such multi-link mechanisms typically are complex and require a substantial amount of room to operate. They also employ multiple axes of rotation for the various linkage members, and tend to suffer from vibrations or other mechanical instabilities, leading to difficulties in precise displacements or necessitating slow movements to achieve accurate positioning of the wafers.
SUMMARY OF THE INVENTION
The present invention provides wafer handling apparatus and methods that overcome the shortcomings of the prior art. It does so by eliminating complex mechanisms such as multi-link structures. In specific embodiments, the wafer handling apparatus employs a pair of transfer arms that are mounted to rotate about a single axis of rotation for supporting a substrate and moving it between stations. The transfer arms are sturdy and involve simple, quick rotations to handle and transfer substrates. The simple mechanism provides stable transfer and accurate positioning of substrates, and requires small displacements and relatively little space to operate.
In accordance with an embodiment of the present invention, a substrate handling apparatus comprises a load lock chamber having a port for transferring substrates in and out of the load lock chamber. A transfer elevator is disposed inside the load lock chamber. The transfer elevator has an upper station with an upper elevator spacing thereabove and a lower station disposed generally below the upper station. The lower station is spaced from the upper station by a lower elevator spacing. The transfer elevator is movable between an up position to generally align the lower station with the port of the load lock chamber and a down position to generally align the upper station with the port of the load lock chamber. A process station is disposed inside the load lock chamber, and has a first portion and a second portion. At least one of the first portion and the second portion is movable relative to the other of the first portion and the second portion between an open position and a closed position. The first portion and the second portion are coupled with each other in the closed position and are separated from each other in the open position by a process station spacing. A transfer device is disposed inside the load lock chamber. The transfer device includes a pair of transfer arms which define an open space therebetween and are movable between the transfer elevator at least partially through one of the upper and lower elevator spacings and the process station at least partially through the process station spacing. The transfer arms are movable relative to each other between a support position and a release position. The transfer arms move toward each other to decrease the size of the open space therebetween in the support position to contact a substrate to support the substrate and move apart from each other to increase the size of the open space therebetween in the release position to release the substrate. The open space between the transfer arms is sufficiently large in the release position to allow movement of at least one of the first portion and the second portion of the process station between the open position and the closed position when the process station is disposed in the open space between the pair of transfer arms.
In accordance with another embodiment of the invention, a substrate handling apparatus comprises a load lock chamber and a transfer station disposed inside the load lock chamber. A process station and a pair of transfer arms are disposed inside the load lock chamber. The apparatus includes means for rotating the pair of transfer arms between the transfer station and the process station substantially along a plane to transfer a substrate between the transfer station and the process station. The apparatus further includes means for moving the pair of transfer arms toward each other substantially along the plane to contact the substrate to support the substrate and moving the pair of transfer arms apart from each other to release the substrate.
Another embodiment of this invention is directed to a device for transferring a wafer between a transfer station and a process station having a first portion and a second portion which are coupled with each other in a closed position and which are spaced from each other by a process station spacing in an open position. The device comprises a pair of transfer arms defining an open space therebetween and being pivotable to rotate between the transfer station and the process station at least partially through the process station spacing between the first and second portions of the process station. A mechanism coupling the pair of transfer arms is provided to adjust the size of the open space. The mechanism decreases the size of the open space to contact the wafer with the pair of transfer arms for supporting the wafer and increases the size of the open space to release the wafer.
Yet another embodiment of the present invention is directed to a method for transferring substrates for processing in a process station having a first portion and a second portion which are coupled with each other in a closed position and which are spaced from each other in an open position by a process station spacing. The method comprises providing a first substrate on a first substrate support of a transfer station, and contacting the first substrate with a pair of transfer arms to support the first substrate between the pair of transfer arms by decreasing the size of an open space between the pair of transfer arms. The first substrate support of the transfer station is separated from the first substrate. The pair of transfer arms are moved to the process station to position the first substrate in the process station spacing between the first portion and the second portion. The first substrate is released from the pair of transfer arms into the process station by increasing the size of the open space between the pair of transfer arms. The first portion and the second portion of the process station are closed for processing the first substrate in the process station in the closed position which is disposed in the open space between the pair of transfer arms.


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