Wafer transfer apparatus and method

Details Wafer transfer apparatus and method Wafer transfer apparatus and method

1995-05-22

1997-12-16

Merritt, Karen B.

Material or article handling

Apparatus for charging a load holding or supporting element...

With simultaneous charging and discharging of plural load...

29 2501, 414936, H02N 1300

Patent

active

056977514

ABSTRACT:
Transfer and processing of semiconductor wafers are performed while maintaining the wafer surfaces in a vertical orientation by holding the water substrate with electrostatic chucking of the rear face thereof. Thereby, the floor area of the transfer and processing system becomes almost the same regardless of the wafer size. Because only the back of the wafer comes in contact with a transfer member, the wafer front surface is kept clean and moreover wafer transfer can be done quickly.

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