Wafer transfer apparatus

Material or article handling – Load carried along a horizontal linear path – Having gripper means

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Details

2941031, 1984682, 901 7, 901 8, 901 16, B65G 6502, B65G 4904

Patent

active

048758248

ABSTRACT:
Transfer mechanism to pick up an object such as a wafer used in the manufacture of semiconductor chips from one location, lift the object, transfer the same laterally, lower it and later deposit the same in another location. A horizontal feedscrew mounted in a stationary base controls horizontal reciprocation of a transverse housing. A vertical feedscrew mounted in the transverse housing controls vertical reciprocation of a second housing. Supported by the second housing are one or more lifts. Each lift has guide rods fixed relative to the second housing and a stop on its lower end. Parallel and adjacent the guide rods is a reciprocating rod carrying a gripper on its lower end. At the end of the vertical movement of the second housing the reciprocating rod moves the gripper away from the stop so that a wafer may rest on the guide rods. As the second housing moves up, the gripper clamps the wafer against the stop. Motors drive the feedscrews to lift the wafer, move it transversely and lower it. As it reaches the end of its lowering movement, the wafer is unclamped.

REFERENCES:
patent: 3648854 (1972-03-01), Potter
patent: 3884363 (1975-05-01), Ajlouny
patent: 4568234 (1986-02-01), Lee et al.
patent: 4648786 (1987-03-01), Sakurai

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