Material or article handling – Horizontally swinging load support – Swinging about pivot
Patent
1989-10-13
1991-03-19
Spar, Robert J.
Material or article handling
Horizontally swinging load support
Swinging about pivot
4147448, 294 93, 901 36, B25J 1510
Patent
active
050006525
ABSTRACT:
A wafer transfer apparatus used in manufacturing high density semiconductor products is disclosed which includes at least three movable arms for supporting a wafer from below thereby preventing contact with the active surface of the wafer. A mechanism for moving the arms into and out of its wafer supporting position is diposed, in part, above the wafer when a wafer is supported thereby. The portions of the actuator mechanism disposed above the wafer are constructed in a way such that no sliding contact occurs between elements thereof. Sliding contact between elements disposed above a wafer has proved to produce microscopic particles which can fall onto the active surface of the wafer thereby contaminating the circuits contained thereon. As sliding contact is avoided by the apparatus of the present invention, contamination particles produced within the wafer transfer apparatus is substantially reduced, if not entirely eliminated.
REFERENCES:
patent: 3343864 (1967-09-01), Baer
patent: 4030622 (1977-06-01), Brooks et al.
patent: 4042128 (1977-08-01), Shrader
patent: 4061627 (1986-06-01), Oka
patent: 4173365 (1979-11-01), Lieb
patent: 4453757 (1984-06-01), Soraoka
patent: 4465416 (1984-08-01), Burkhalter et al.
patent: 4466766 (1983-05-01), Geren
patent: 4474399 (1984-10-01), Lauber
patent: 4504186 (1985-03-01), Richards
patent: 4530636 (1985-07-01), Inaba
patent: 4540211 (1985-09-01), Masserang
patent: 4553069 (1984-01-01), Purser
patent: 4653793 (1987-03-01), Guinet et al.
G. Delannoy, IBM Technical Disclosure Bulletin, vol. 25, No. 5, Oct., 1982, "Holder Device for Handling Semiconductor Wafers", pp. 2334-2335.
Christensen Richard G.
Mack Alfred
Crane John D.
Hienz William M.
International Business Machines - Corporation
Spar Robert J.
Warnot, Jr. James R.
LandOfFree
Wafer transfer apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer transfer apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer transfer apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2006470