Wafer tilt compensation in zone plate alignment system

Details Wafer tilt compensation in zone plate alignment system Wafer tilt compensation in zone plate alignment system

1981-04-15

1983-08-16

Rosenberger, R. A.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

35016216, G01B 1127

Patent

active

043988245

ABSTRACT:
The present invention is a method and apparatus for aligning a semiconductor wafer to be patterned by a step-and-repeat photolithographic system. The inventive alignment technique, which is able to compensate for local wafer tilt and/or nonuniform photoresist thickness, is applicable to semiconductor wafers which have, on a surface portion, one or more Fresnel zone plate alignment marks.

REFERENCES:
patent: 3990798 (1976-11-01), White
patent: 4037969 (1977-07-01), Feldman et al.
patent: 4326805 (1982-04-01), Feldman et al.

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