Wafer test equipment and method of aligning test equipment

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

Reexamination Certificate

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Details

C324S758010

Reexamination Certificate

active

11104337

ABSTRACT:
Wafer test equipment includes a probe station having a wafer chuck for supporting a wafer, a test head disposed on the probe station, a manipulator for moving the test head to and from an upper surface of the probe station, and an alignment monitoring member for monitoring an alignment of the test head docked to the probe station.

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patent: 07-174819 (1995-07-01), None
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patent: 2003-0060221 (2003-07-01), None
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Patent Abstracts of Japan for Publication No. 2000-315711.
Korean Intellectual Property Office, Korean Patent Abstract for Publication No. 2003-0060221.
Abstract of Korean Utility Application No. 20-1994-0036955 (Publication No. 1996-025399).

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