Wafer temperature monitoring device utilizing flexible thermocou

Details Wafer temperature monitoring device utilizing flexible thermocou Wafer temperature monitoring device utilizing flexible thermocou

1998-12-22

2000-03-21

Gorgos, Kathryn

Batteries: thermoelectric and photoelectric

Thermoelectric

Processes

374179, 374208, 136230, H01L 3534

Patent

active

06040518&

ABSTRACT:
A thermocouple support arm assembly (20) is provided, comprising (i) an arm (28) extending longitudinally along a first axis (X) and having a thermocouple (30) extending therefrom; (ii) an anvil (40) supported by the arm (28) and at least partially occupying a plane defined by a second axis (Y) and a third axis (Z), the anvil positioned below the thermocouple; and (iii) a mounting mechanism (36) for mounting the anvil (40) on the arm (28) such that the anvil (40) is permitted three degrees of rotational freedom with respect to the arm along, respectively, axes X, Y and Z. When a substrate such as a semiconductor wafer is positioned above the thermocouple (30) to at least partially rest upon the thermocouple and the anvil (40), the anvil moves with respect to the arm (28) along the axes (X, Y, Z) to force the thermocouple into contact with the substrate. The thermocouple (30) is constructed of a flexible foil that elastically deforms to conform to the underside of the substrate, when the anvil forces the thermocouple into contact with the substrate, to provide a plurality of contact points (48, 50, 52, 54) between the thermocouple and the substrate. A generally planar shield member may be provided extending from the support arm (28) and located below the anvil (40).

REFERENCES:
patent: 5106200 (1992-04-01), Hosokawa
patent: 5315092 (1994-05-01), Takahashi et al.
patent: 5356486 (1994-10-01), Sugarman et al.
patent: 5446824 (1995-08-01), Moslehi
patent: 5567909 (1996-10-01), Sugarman et al.

Affiliated with

Also associated with

Rating

Wafer temperature monitoring device utilizing flexible thermocou does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer temperature monitoring device utilizing flexible thermocou, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer temperature monitoring device utilizing flexible thermocou will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-731970