Wafer target design and method for determining centroid of...

Details Wafer target design and method for determining centroid of... Wafer target design and method for determining centroid of...

2005-05-03

2005-05-03

Wachsman, Hal (Department: 2857)

Data processing: measuring, calibrating, or testing

Measurement system

Dimensional determination

C702S159000, C356S625000

Reexamination Certificate

active

06889162

ABSTRACT:
A method for determining the centroid of a wafer target. In one embodiment, the method comprises a series of steps in a stepper, starting with the step of receiving a wafer, having a target set formed therein. Next, a signal is passed over the target set and over a material separating target shapes in the target set. Then a return signal is reflected, and received, from the surface of the target shapes and the material separating them. A location of at least one maxima point of the return signal is identified. Finally, a centroid is determined as the median of the locations of at least one maxima point.

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patent: 05-013306 (1993-01-01), None
Translation of JP 05-013306, Jan. 1993.*
Patent Abstracts of Japan, vol. 017, No. 272 (E-1371), May 26, 1993-& JP 05 013306 A (Fujitsu Ltd) Jan. 22, 1993 abstract; figures.

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