Wafer susceptor

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

118500, 156345, 2041921, 414222, B05C 1114, C23F 102

Patent

active

048971715

ABSTRACT:
A wafer susceptor is disclosed. The wafer susceptor has: a first conductive electrode which includes its flat surface covered with a thin insulating film; a second conductive electrode which is electrically insulated from the first conductive electrode and is disposed so that the surface thereof is flush with the surface of the thin insulating film which covers the first conductive electrode; a means for imparting a specified electric potential to the second conductive electrode; and a means for applying a predetermined voltage between the first conductive electrode and the second conductive electrode. With this constitution, the wafer susceptor is capable of adsorbing a wafer by an electrostatic force and of regulating an electric potential of the wafer to a predetermined value in time of the wafer being adsorbed.

REFERENCES:
patent: 4384918 (1983-05-01), Abe
patent: 4399016 (1983-08-01), Tsukada et al.
patent: 4595452 (1986-06-01), Landau etal.
patent: 4657617 (1987-04-01), Johnson et al.
patent: 4668373 (1987-05-01), Rille et al.

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