Wafer surface treating apparatus using chemical

Coating apparatus – With treatment of coating material – Of recirculated coating material

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Details

118610, 118666, 134110, 134108, B05C 1100, B08B 300

Patent

active

057413622

ABSTRACT:
A wafer surface treating apparatus has an overflow treating tank for holding therein a chemical in which a wafer is to be soaked to perform a surface treatment of the wafer, piping for circulating the chemical overflowing from said treating tank to said treating tank, a filter unit for filtering the chemical passing through said piping to remove foreign articles from the chemical, and at least two temperature regulating mechanisms. The first temperature regulating mechanism keeps a temperature of the chemical in said treating tank at a predetermined temperature. The second temperature regulating mechanism regulates the temperature of the chemical in said filter unit to a temperature at which no deposit is produced from the chemical in said filter.

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