Wafer surface inspection apparatus and wafer surface...

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

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C314S018000, C250S307000

Reexamination Certificate

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07420668

ABSTRACT:
A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.

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patent: 5958268 (1999-09-01), Engelsberg et al.
patent: 6005660 (1999-12-01), Yoshida et al.
patent: 6356653 (2002-03-01), Brigante et al.
patent: 6566169 (2003-05-01), Uziel et al.
patent: 6799584 (2004-10-01), Yogev et al.
patent: 6844458 (2005-01-01), Copeland et al.
patent: 7159599 (2007-01-01), Verhaverbeke et al.
patent: 2003/0029479 (2003-02-01), Asano
patent: 55-102233 (1980-08-01), None

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