Wafer support fixtures for rapid thermal processing

Details Wafer support fixtures for rapid thermal processing Wafer support fixtures for rapid thermal processing

1994-10-14

1996-05-07

Ahmad, Nasser

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118500, 118725, 118730, 219638, 219649, 428156, 428408, 428698, 428704, B32B 302

Patent

active

055144390

ABSTRACT:
A fixture for supporting a semiconductor wafer during rapid thermal processing, comprising a two-piece assembly of parts, one of which is a silicon carbide wafer support section having a wafer contact face shaped by direct contact with a mold, during its formation by chemical vapor deposition. The other piece is a holding section shaped to keep the wafer support section in place within the reactor. The two-piece assembly improves thermal performance, compared with a one-piece fixture, because the rate of heat conduction across the gap between parts is always less than the rate of heat conduction through a one-piece fixture having the same dimensions.

REFERENCES:
patent: 4301132 (1981-11-01), Kennedy
patent: 4761134 (1988-08-01), Foster
patent: 4962441 (1990-10-01), Collins
patent: 4978567 (1990-12-01), Miller
patent: 5192371 (1993-03-01), Shuto
"Electrical Conductivity Calculations For GH-SiC" by M. Ghezzo, Tech. Info. Series, GE Research & Development Center, Mar. 1992.

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