Wafer support assembly

Details Wafer support assembly Wafer support assembly

1988-02-12

1988-10-25

Weidenfeld, Gil

Chucks or sockets

With fluid-pressure actuator

Socket type

118503, 269254R, 279106, B23B 522

Patent

active

047798777

ABSTRACT:
An assembly is provided for supporting semiconductor wafers individually within a support while permitting processing of both faces of a wafer as well as facilitating rapid insertion and removal of wafers into the support. Each assembly includes a wire clip having an arcuate tip used to grasp the wafer. The wire clip can be moved in two planes by actuating mechanisms, thereby moving the clip out of the plane of wafer processing and facilitating loading in the wafer processing plane.

REFERENCES:
patent: 4306731 (1981-12-01), Shaw
patent: 4311427 (1982-01-01), Coad et al.
patent: 4350116 (1982-09-01), Grandia et al.

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