Wafer supplying apparatus

Details Wafer supplying apparatus Wafer supplying apparatus

1988-12-28

1990-06-26

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

29413, 294266, 156344, 225103, B32B 3118

Patent

active

049369440

ABSTRACT:
A wafer supplying apparatus including a supply ring to which a wafer sheet having semiconductor pellets adhered thereto is attached, a ring holder provided on an X-Y table of a pellet pick-up device, the ring holder supporting and placing the wafer sheet onto the upper surface of a cylindrical portion of the ring holder having an external diameter smaller than the internal diameter of the supply ring, a pressing ring provided above the supply ring, a pusher which pushes down the supply ring around the cylindrical portion of the ring holder through the pressing ring, and a fastener which fastens the pressing ring to the ring holder after the supply ring has been pushed down by the pusher.

REFERENCES:
patent: 3537603 (1970-11-01), Willis et al.

Affiliated with

Also associated with

Rating

Wafer supplying apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer supplying apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer supplying apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1123876