Wafer stepper method utilizing a multi-segment global alignment

Details Wafer stepper method utilizing a multi-segment global alignment Wafer stepper method utilizing a multi-segment global alignment

1998-09-21

2000-02-08

Young, Christopher G.

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

438975, G03F 900

Patent

active

060226498

ABSTRACT:
A multi-segment alignment mark useful for a variety of processes is described. The multi-segment alignment mark comprises a plurality of segments wherein each of the segments comprises a series of sub-segments wherein each of the sub-segments comprises a series of spaces and lines, each sub-segment having the same width but having a different number of spaces and lines within the width depending on the relative width of the spaces and lines. A wafer stepper detects signals from each of the sub-segments and uses the best signal to achieve alignment.

REFERENCES:
patent: 5369050 (1994-11-01), Kawai
patent: 5401691 (1995-03-01), Caldwell
patent: 5496777 (1996-03-01), Moriyama
patent: 5627624 (1997-05-01), Yim et al.
patent: 5648854 (1997-07-01), McCoy et al.
patent: 5800951 (1998-09-01), Hashimoto

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