Wafer spin dryer and method of drying a wafer

Details Wafer spin dryer and method of drying a wafer Wafer spin dryer and method of drying a wafer

1996-07-15

1998-07-14

Bennett, Henry A.

Drying and gas or vapor contact with solids

Apparatus

With apparatus using centrifugal force

F26B 1724

Patent

active

057785546

ABSTRACT:
In a spin dryer for semiconductor wafers, the wafer is held beneath a platen with its active side (i.e., the side containing the components or circuitry) facing upward. One or more nozzles spray rinse water on the top surface of the wafer and the wafer is rotated to remove the excess rinse water, thereby drying the wafer. A splash guard adjacent the edge of the wafer insures that the excess rinse water thrown off by the spinning wafer is deflected downward where it cannot again come into contact with the active side of the wafer. The platen is rotated dry at the same time, with no rinse water being splashed back onto the active side of the wafer. The spin dryer also includes a separate section which cleans and dries the end-effector of the robot which inserts the wafer into the spin dryer while the wafer is being dried.

REFERENCES:
patent: 4313266 (1982-02-01), Tam
patent: 4651440 (1987-03-01), Karl
patent: 4924890 (1990-05-01), Glles et al.
patent: 4989345 (1991-02-01), Gill, Jr.
patent: 5050316 (1991-09-01), Aigo
patent: 5468302 (1995-11-01), Thietje
patent: 5469634 (1995-11-01), Mezaki

Affiliated with

Also associated with

Rating

Wafer spin dryer and method of drying a wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer spin dryer and method of drying a wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer spin dryer and method of drying a wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1871097