Wafer softlanding system and cooperative door assembly

Heating – Accessory means for holding – shielding or supporting work...

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432 6, 432 36, 432239, F27D 500

Patent

active

047522194

ABSTRACT:
A wafer softlanding system and cooperative door assembly are disclosed for gently and reliably loading and unloading a batch of wafers onto and off of the floor of a processing furnace tube. The disclosed softlanding system is coupled to a wafer receiving paddle and is operable to both linearly move the paddle as a whole in Z either upwardly or downwardly and to selectively rotatably move the paddle so that it tilts about an axis as it is moved linearly up and down. A door assembly is disclosed that includes a resiliently mounted furnace closure that is operative to provide a self-seating action at the mouth of the processing furnace tube. The door assembly includes in one embodiment a vacuum door closure and in another embodiment an atmospheric process door closure. In both embodiments, the closure members are readily releasable to provide for each of interchangeability, maintenance, and differential door size accommodation.

REFERENCES:
patent: 3723053 (1973-03-01), Myers et al.
patent: 3819067 (1974-06-01), Hammond
patent: 4129090 (1978-12-01), Inaniwa et al.
patent: 4439146 (1984-03-01), Sugita
patent: 4468195 (1984-08-01), Sasaki et al.
patent: 4484538 (1984-11-01), Sankozy et al.
patent: 4543059 (1985-09-01), Whang et al.

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