Wafer slicing and grinding system

Details Wafer slicing and grinding system Wafer slicing and grinding system

1990-05-18

1993-02-16

Rose, Robert A.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

511659, 51168, 125 1302, 81 573, 81 5736, B24B 2706

Patent

active

051859564

ABSTRACT:
The grinding wheel is provided with a plurality of circumferentially spaced apart micrometer screws which can be adjusted from time to time in order to index the grind wheel into different grinding positions. An indexing mechanism can be mounted on the face of the disk with drive pins extending through the disk into the micrometer screws for simultaneous rotation of the screws. The indexing mechanism is lightweight and can be readily attached to the face of the grind disk.

REFERENCES:
patent: 1503102 (1924-07-01), Alsted
patent: 2661580 (1953-12-01), Crompton, Jr.
patent: 2716312 (1955-08-01), Speicher
patent: 3133462 (1964-05-01), Whipp
patent: 3636664 (1972-01-01), Price
patent: 4852304 (1989-08-01), Honda et al.
patent: 4881518 (1989-11-01), Feldmeier
patent: 4896459 (1990-01-01), Brandt

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