Wafer slicing and grinding machine and a method of slicing and g

Details Wafer slicing and grinding machine and a method of slicing and g Wafer slicing and grinding machine and a method of slicing and g

1993-02-24

1994-07-19

Rachuba, M.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51283R, 125 1302, B24B 4900

Patent

active

053297334

ABSTRACT:
A wafer slicing and grinding machine is provided with a saw blade assembly for the slicing of wafers from an ingot. A grinding stage is also provided for sequentially grinding the rear face of a previously sliced wafer and the front face of an ingot in order to provide a double ground wafer. A transfer chuck and a holding chuck are disposed within the machine to perform movements for effecting a turning over of a wafer for grinding of the rear face of the wafer.

REFERENCES:
patent: 3740900 (1973-06-01), Youmans et al.
patent: 4420909 (1983-12-01), Steere, Jr.
patent: 4852304 (1989-08-01), Honda et al.
patent: 4881518 (1989-11-01), Feldmeier
patent: 4896459 (1990-01-01), Brindt
patent: 4930262 (1990-06-01), Sennewald
patent: 5025593 (1991-06-01), Kawaguchi et al.

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