Wafer slicer base peeling system

Details Wafer slicer base peeling system Wafer slicer base peeling system

1997-04-10

1998-06-02

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

156344, 294265, B32B 3500

Patent

active

057593442

ABSTRACT:
The hot water is stored in the hot-water tank and kept at the predetermined temperature. The clamp base is provided in the hot water of the hot-water tank for receiving the substrate portion of the wafer and the lifter is arranged for moving the wafer from the upper part of the hot-water tank into the hot water. The clamper is placed at the upper of the clamp base and the substrate portion of the wafer is pushed to the clamp base fixedly and the pusher is arranged at the upper side of the clamp base in the vicinity of the clamper so as to push the slice base of the wafer, whereby the slice base is peeled. The peeling is performed in the hot water, therefore, the temperature of the wafer does not lower while peeling, so that the adhesive can be peeled easily.

REFERENCES:
patent: 4537244 (1985-08-01), Holden
patent: 4921564 (1990-05-01), Moore
patent: 5240882 (1993-08-01), Satoh et al.
patent: 5427644 (1995-06-01), Nagatsuka et al.
patent: 5578167 (1996-11-01), Sooriakumar et al.
patent: 5656127 (1997-08-01), De Niel et al.

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