Wafer shuttle system

Abrading – Work feeder – Reciprocating

Patent

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Details

451339, B24B 4720, B24B 4702

Patent

active

059478020

ABSTRACT:
A shuttle system for transferring a semiconductor wafer from a receiving station to a horizontal-oriented head drive of a wafer polishing machine includes a linear horizontal rail extending from a first position to a second position; a wafer transfer assembly adjacent to the first position; a wafer conveying assembly movable along the rail from adjacent the first position to adjacent the second position; and wherein the wafer conveying assembly includes a vertically movable and radially movable gripper for gripping peripheral edges of a wafer to be transferred and conveyed from the transfer assembly to the head drive. The transfer assembly includes a transfer receiver for receiving an unpolished wafer from a cassette which receiver is movable to the second position where the gripper is movable to edge-grip the received unpolished wafer. The gripper includes a series of radially movable segments having edge-contacting fingers depending therefrom for gripping the wafer edges. A polished wafer is conveyed by the gripper along the rail to a rinsing bath including an unloading ring movable up and down in the bath.

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patent: 5800254 (1998-09-01), Motley et al.

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