Wafer shipping device and storage method for preventing...

Special receptacle or package – Holder for a removable electrical component – For a semiconductor wafer

Reexamination Certificate

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C206S213100

Reexamination Certificate

active

10600539

ABSTRACT:
A wafer-shipping device and a wafer storage method for protecting bonding pads from fluoridation. First, at least one through hole is drilled in the shipping box. The wafer is then placed in the shipping box. A packaging bag containing the shipping box is put into a vacuum packaging machine to remove air from the packaging bag and the shipping box. A dry inert gas is then introduced into the packaging bag and the shipping box until approaching atmospheric pressure as so to prevent the shipping box from collapse. The packaging bag is then sealed.

REFERENCES:
patent: 4248346 (1981-02-01), Johnson
patent: 5944193 (1999-08-01), Shimizu
patent: 6003674 (1999-12-01), Brooks
patent: 6269945 (2001-08-01), Colombo
patent: 6467626 (2002-10-01), Misaka
patent: 6533000 (2003-03-01), Saga
patent: 6685012 (2004-02-01), Bowden et al.
patent: 6770109 (2004-08-01), Tanaka et al.

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