Wafer shape detecting method

Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system

Patent

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Details

356400, G01N 2186

Patent

active

051592029

ABSTRACT:
An apparatus and method for detecting the shape of a circular, disk-like silicon wafer is disclosed in which both ends of a major orientation flat are detected by rotating the wafer at least one turn relative to the position of an optical sensor positioned slightly inside the wafer's outer circumference. The shape data thus obtained may be used to guide a cutting device to remove excess adhesive tape around the outer circumference of the wafer.

REFERENCES:
patent: 3718823 (1973-02-01), Niikura et al.
patent: 4238780 (1980-12-01), Doemens
patent: 4752696 (1988-06-01), Matsushita et al.

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