Wafer shape and method of making same

Stock material or miscellaneous articles – Circular sheet or circular blank – Ornamental – decorative – pattern – or indicia

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4285428, 428213, B32B 302

Patent

active

045797609

ABSTRACT:
A semiconductor wafer shape which when subjected to a simultaneous polishing of both wafer surfaces produces a wafer of superior flatness and surface finish, the said wafer having a diametral cross-sectional shape like that of a "dogbone" wherein the wafer is thinner in its medial region than it is in the peripheral region and has rounded edges, this shape resulting from a chemical thinning operation.

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