Wafer separating and cleaning apparatus and process

Details Wafer separating and cleaning apparatus and process Wafer separating and cleaning apparatus and process

1999-02-04

2000-10-31

Graybill, David E.

Metal working

Barrier layer or semiconductor device making

438463, H01L 2100, H01L 2164, H01L 2146, H01L 2178, H01L 21301

Patent

active

061395919

ABSTRACT:
An individual wafer separating part separates batched wafers one by one from a slice base mounting beam, and then a shuttle conveyor transports the separated wafers one by one to an individual cleaning part so that the wafers can be cleaned individually. After the cleaning, a detecting part detects the thickness, breaking, chipping and remaining adhesives of the wafers. The wafers are classified in accordance with the results of the detection. Normal wafers are collected in wafer collecting parts, failed wafers are collected in a failed wafer collecting part, and wafers with remaining adhesives are collected into an adhesive remaining wafer collecting part.

REFERENCES:
patent: 4903681 (1990-02-01), Honda et al.
patent: 4949700 (1990-08-01), Ebashi
patent: 5142756 (1992-09-01), Ibaraki et al.

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