Wafer securing device and method

Coating apparatus – Work holders – or handling devices

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Details

269 21, 211 4118, B05C 1300, B25B 1100

Patent

active

060510676

ABSTRACT:
A wafer securing device and method for securing a planar plate on a wafer having a hollowed-out portion, the device including a substrate for receiving the wafer; a groove provided on the substrate and having an opening, the hollowed-out portion corresponding to the groove when the wafer is placed on the substrate; and an air extracting equipment for extracting air from the groove when the wafer is placed on the substrate so that the planar plate placed on the wafer is secured to the wafer by means of a vacuum suction force.

REFERENCES:
patent: 4131267 (1978-12-01), Ono et al.
patent: 4603466 (1986-08-01), Morley
patent: 5436693 (1995-07-01), Marumo

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