Wafer scribe technique using laser by forming polysilicon

Details Wafer scribe technique using laser by forming polysilicon Wafer scribe technique using laser by forming polysilicon

1994-12-02

1996-08-06

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

437227, 148DIG28, H01L 21302

Patent

active

055433650

ABSTRACT:
A channel is formed in a wafer to fore descrite die. A portion of the wafer is heated in the channel. A portion of the heated portion is cooled to eliminate the uniform structure. The cooled portion is scribed to separate the die.

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