Wafer scale thermal stress fixture and method

Details Wafer scale thermal stress fixture and method Wafer scale thermal stress fixture and method

2006-02-07

2006-02-07

Wilson, Gregory (Department: 3749)

Heating

Heating or heat retaining work chamber structure

C432S253000, C118S725000, C118S728000

Reexamination Certificate

active

06994544

ABSTRACT:
A fixture for supporting a plurality of semiconductor chips during the thermal cycling of the chips, including a fluid-permeable bottom screen, a chip-cavity-defining plate supported against a top surface of the bottom screen, a lower attaching mechanism for attaching the chip-cavity-defining plate to the top surface of the bottom screen, and a removable fluid-permeable top screen attached to a top surface of the chip-cavity-defining plate to cover the plurality of holes and chips therein.

REFERENCES:
patent: 5885353 (1999-03-01), Strodtbeck et al.
patent: 5906683 (1999-05-01), Chen et al.
patent: 6416318 (2002-07-01), Lee et al.
patent: 6444037 (2002-09-01), Frankel et al.
patent: 6884066 (2005-04-01), Nguyen et al.

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