Wafer-scale techniques for fabrication of semiconductor chip ass

Details Wafer-scale techniques for fabrication of semiconductor chip ass Wafer-scale techniques for fabrication of semiconductor chip ass

1994-10-07

1997-11-11

Hughes, S. Thomas

Metal working

Method of mechanical manufacture

Electrical device making

29840, 29842, 29855, H05K 330

Patent

active

056858850

ABSTRACT:
Semiconductor chip assemblies are fabricated by assembling flexible, sheetlike elements bearing terminals to a wafer, connecting the terminals of each sheetlike element to contacts on the chip, and subsequently severing the chips from the wafer to provide individual assemblies. Each assembly includes a sheetlike element and a chip, arranged so that the terminals on the flexible element.

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