Wafer-scale microcolumn array using low temperature co-fired...

Details Wafer-scale microcolumn array using low temperature co-fired... Wafer-scale microcolumn array using low temperature co-fired...

2005-10-24

2009-10-06

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

C438S594000, C250S311000

Reexamination Certificate

active

07598594

ABSTRACT:
Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.

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