Wafer-scale manufacturing method

Details Wafer-scale manufacturing method Wafer-scale manufacturing method

2005-07-26

2005-07-26

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S112000, C257S098000

Reexamination Certificate

active

06921676

ABSTRACT:
The wafer-scale assembly method provides first elements arrayed on a wafer with adjacent ones of the first elements separated by a predetermined spacing. Second elements are also provided. A spacing-defining jig is provided that includes recesses corresponding in size to the second elements. Adjacent ones of the recesses are separated by a spacing equal to the predetermined spacing. The second elements are inserted into the recesses of the spacing-defining jig and are then affixed to the wafer with the second elements in alignment with corresponding ones of the first elements. Inserting the second elements in to the jig in which the recesses are separated by a spacing equal to the predetermined spacing allows a single alignment operation to provide accurate alignment between all the first elements, e.g., image sensors, arrayed on the wafer and all the second elements, e.g., lens assemblies, that are to be affixed to the first elements arrayed on the wafer.

REFERENCES:
patent: 6235141 (2001-05-01), Feldman et al.
patent: 6406583 (2002-06-01), Harden et al.
patent: 6759723 (2004-07-01), Silverbrook
patent: 2004/0235211 (2004-11-01), Plichta et al.

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