Wafer scale integration device

Details Wafer scale integration device Wafer scale integration device

1990-03-29

1992-06-30

James, Andrew J.

357 65, 357 80, 357 55, H01L 2304, H01L 2302

Patent

active

051268280

ABSTRACT:
A WSI device comprises a semiconductor substrate having a wafer scale size. An integrated circuit having a unified function is formed on a main surface of the semiconductor substrate. The semiconductor substrate defines various cutouts centrally and/or peripherally thereof. The cutouts serve to extend peripheral regions of the semiconductor substrate. Bonding pads are formed along the extended peripheral regions of the semiconductor substrate. As a result, the number of bonding pads that can be formed is increased to promote multi-functioning of the WSI device.

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patent: 4920454 (1990-04-01), Stopper et al.
patent: 4965653 (1990-10-01), Otsuka
Christian Val, "Wafer Scale Integration (WSI) Packaging," Wafer Scale Integration, Elsevier Publishers B. V. (North-Holland) .COPYRGT.IFIP 1986, pp. 321-344.

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