Wafer scale heat slug system

Details Wafer scale heat slug system Wafer scale heat slug system

2011-07-12

2011-07-12

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S837000, C174S261000, C361S760000, C361S761000

Reexamination Certificate

active

07975377

ABSTRACT:
A wafer scale heat slug system is presented providing dicing an integrated circuit from a semiconductor wafer, forming a heat slug blank equivalent in size to the semiconductor wafer, dicing the heat slug blank to produce a heat slug equivalent in size to the integrated circuit, attaching the integrated circuit to a substrate, attaching the heat slug to the integrated circuit and encapsulating the integrated circuit.

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