Wafer scale burn-in apparatus and process

Details Wafer scale burn-in apparatus and process Wafer scale burn-in apparatus and process

1993-08-17

1996-10-29

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, 324765, G01R 106

Patent

active

055700322

ABSTRACT:
An apparatus for wafer scale burn-in and testing of semiconductor integrated circuits and a method for its utilization. A wafer is mated to a printed circuit board which electrically contacts the pads on each die using small conductive pillars. Single precise alignment of entire wafer within apparatus allows for testing all the dice on the wafer in parallel, eliminating need to probe each die individually. The apparatus is fitted with heating elements and cooling channels to generate the necessary wafer temperatures for burn-in and testing. The method of utilization eliminates processing of defective dice beyond burn-in and test, thereby increasing throughput.

REFERENCES:
patent: 3963985 (1976-06-01), Geldermans
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4968931 (1990-11-01), Littlebury et al.
patent: 5010296 (1991-04-01), Okada et al.
patent: 5034685 (1991-07-01), Leedy
patent: 5034688 (1991-07-01), Moulene et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5198752 (1993-03-01), Miyata et al.
patent: 5198753 (1993-03-01), Hamburgen
patent: 5210485 (1993-05-01), Kreiger et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5325052 (1994-06-01), Yamashita
patent: 5342807 (1994-08-01), Kinsman et al.

Affiliated with

Also associated with

Rating

Wafer scale burn-in apparatus and process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer scale burn-in apparatus and process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer scale burn-in apparatus and process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1788337