Wafer scale antenna module with a backside connectivity

Details Wafer scale antenna module with a backside connectivity Wafer scale antenna module with a backside connectivity

2006-03-20

2009-06-16

Dinh, Trinh V (Department: 2821)

Communications: radio wave antennas

Antennas

Microstrip

C343S792000

Reexamination Certificate

active

07548205

ABSTRACT:
In one embodiment, wafer-scale antenna module is provided that includes: a substrate having a first surface and an opposing second surface; a plurality of conductive contact regions extending from the first surface into the substrate towards the second surface; active circuitry formed in the substrate adjacent the second surface, the active circuitry electrically coupled to the conductive contact regions; an insulating layer adjacent the first surface, the insulating layer forming a plurality of vias arranged corresponding to the plurality of conductive contact regions, each via forming an opening at the corresponding conductive contact region; and a plurality of antennas formed on the insulating layer corresponding to the plurality of vias; wherein each via contains an electrical conductor to electrically couple the corresponding contact region to the antenna corresponding to the via, whereby a resulting separation between the driving circuitry and the antennas aids an electrical isolation of the driving circuitry from the antennas.

REFERENCES:
patent: 5400039 (1995-03-01), Araki et al.
patent: 6864585 (2005-03-01), Enquist
patent: 6885344 (2005-04-01), Mohamadi
patent: 7126212 (2006-10-01), Enquist et al.
patent: 7312763 (2007-12-01), Mohamadi
patent: 7423607 (2008-09-01), Mohamadi
patent: 2003/0119279 (2003-06-01), Enquist

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