Wafer sawing technique

Details Wafer sawing technique Wafer sawing technique

1977-11-03

1979-02-06

Drummond, Douglas J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29412, 29424, 51283R, 125 13R, 83 14, B24B 100, B32B 3100, B28D 104

Patent

active

041383044

ABSTRACT:
A method for dividing a semiconductor wafer into pellets includes attaching the wafer to a vinyl membrane with a coupling material which adheres more tenaciously to the membrane than to the pellets and sawing completely through the wafer and at least partially through the coupling material to separate the wafer into discrete pellets. In accordance with a preferred method, the membrane is at least slightly cut by the saw to insure complete division of the wafer. The pellets are readily removed from the coated membrane without any residues remaining thereon from the coupling material. A resinous vinyl coupling material is preferred.

REFERENCES:
patent: 3081586 (1963-03-01), Gersbach
patent: 3152939 (1964-10-01), Borneman et al.
patent: 3247589 (1966-04-01), Burns

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