Wafer sawing method

Details Wafer sawing method Wafer sawing method

2008-03-12

2009-11-03

Menz, Douglas M (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S110000, C438S462000

Reexamination Certificate

active

07611967

ABSTRACT:
A wafer sawing method for sawing a wafer by using a cutting tool is provided. Sawing paths are formed on a surface of the wafer. In the wafer sawing method, a carrier on which strip-shaped adhesives or at least a fiducial mark is formed is firstly provided. The dimension of the carrier is greater than the dimension of the wafer. Next, the surface of the wafer is bonded to the carrier, and the strip-shaped adhesives or the fiducial mark is extended or located outside a bonding region between the wafer and the carrier. Here, the surface of the wafer faces the carrier. The cutting tool and the carrier are positioned according to the strip-shaped adhesives or the fiducial mark outside the bonding region. The wafer is then sawed by using the cutting tool. The wafer sawing method provides a precise and rapid sawing process and achieves superior productive yield.

REFERENCES:
patent: 6284569 (2001-09-01), Sheppard et al.

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