Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2008-03-12
2009-11-03
Menz, Douglas M (Department: 2891)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S110000, C438S462000
Reexamination Certificate
active
07611967
ABSTRACT:
A wafer sawing method for sawing a wafer by using a cutting tool is provided. Sawing paths are formed on a surface of the wafer. In the wafer sawing method, a carrier on which strip-shaped adhesives or at least a fiducial mark is formed is firstly provided. The dimension of the carrier is greater than the dimension of the wafer. Next, the surface of the wafer is bonded to the carrier, and the strip-shaped adhesives or the fiducial mark is extended or located outside a bonding region between the wafer and the carrier. Here, the surface of the wafer faces the carrier. The cutting tool and the carrier are positioned according to the strip-shaped adhesives or the fiducial mark outside the bonding region. The wafer is then sawed by using the cutting tool. The wafer sawing method provides a precise and rapid sawing process and achieves superior productive yield.
REFERENCES:
patent: 6284569 (2001-09-01), Sheppard et al.
Advanced Semiconductor Engineering Inc.
Menz Douglas M
Patents J. C.
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