Wafer rotation device and edge flaw inspection apparataus...

Metal working – Barrier layer or semiconductor device making

Reexamination Certificate

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Reexamination Certificate

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10523844

ABSTRACT:
A wafer rotating device1is provided with at least three rollers2rotatably provided about axes arranged at parallel intervals and which rotate over the circumferential surface of a disk-shaped wafer5, a rotation drive mechanism3that rotates and drives at least one of the rollers2, an interval adjustment mechanism4capable of adjusting the dimensions of the intervals of the rollers2, a load control device6that controls the load applied from the rollers2to the wafer5in the radial direction of the wafer5when the wafer5is clamped between rollers2. As a result, a silicon wafer can be rotated without contacting the top and bottom surfaces of the silicon wafer.

REFERENCES:
patent: 5113565 (1992-05-01), Cipolla et al.
patent: 2001/0039168 (2001-11-01), Engdahl et al.
patent: 2004/0070414 (2004-04-01), Tani
patent: 2005/0190259 (2005-09-01), Mitsuhashi et al.
patent: 6-310485 (1994-11-01), None
patent: 7-297155 (1995-11-01), None
patent: 9-269298 (1997-10-01), None
patent: 10-294304 (1998-11-01), None
patent: 2000-164681 (2000-06-01), None
International Search Report dated Nov. 11, 2003.

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