Wafer ring supply and return device

Details Wafer ring supply and return device Wafer ring supply and return device

1996-08-16

1998-10-20

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

294263, 294265, 414941, 438 7, B32B 3100

Patent

active

058241850

ABSTRACT:
A device for conveying a wafer ring between a wafer ring container and a pellet pick-up device. The wafer ring having a wafer sheet with semiconductor pellets adhered on it is held at its one end by a pair of claws that is equipped with a sensor for detecting the wafer ring held by the claws. After determining the presence of the wafer ring held by the pair of claws, the claws carry the wafer ring onto the pellet pick-up device and then carries the wafer ring back to the wafer ring container. The sensor can be installed on either one of the pair of the claws.

REFERENCES:
patent: 4638601 (1987-01-01), Steere et al.
patent: 4770121 (1988-09-01), Ebata et al.
patent: 4819167 (1989-04-01), Cheng et al.

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