Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
Reexamination Certificate
2006-08-29
2006-08-29
Pham, Thanhha (Department: 2813)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Electrical characteristic sensed
C438S014000
Reexamination Certificate
active
07098047
ABSTRACT:
Briefly, test wafer reuse techniques.
REFERENCES:
patent: 4526468 (1985-07-01), Steigmeier et al.
patent: 6406981 (2002-06-01), Ravi
patent: 6761625 (2004-07-01), Rojhantalab et al.
Choi Glen B.
Pham Thanhha
LandOfFree
Wafer reuse techniques does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer reuse techniques, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer reuse techniques will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3657415