Wafer retrieval method in multiple slicing wire saw

Details Wafer retrieval method in multiple slicing wire saw Wafer retrieval method in multiple slicing wire saw

1998-12-02

2000-09-19

Eley, Timothy V.

Stone working

Sawing

125 1602, 125 21, B28D 102

Patent

active

061196738

ABSTRACT:
Partitions are inserted between different kinds of wafers, which have been sliced from different kinds of ingots by a wire saw. The partitioned wafers are stored in a cassette, and are soaked in hot water with the cassette. The wafers are separated from slice base mounting beams. After the separation, the wafers are retrieved into the cassette in the state of being partitioned between the wafer lots.

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