Wafer proximity sensor

Measuring and testing – With fluid pressure – Dimension – shape – or size

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G01B 13012

Patent

active

052243745

ABSTRACT:
The distance between a semiconductor wafer and a bake/chill plate is determined by a feed back system using a flow meter. The wafer forms part of the feed back system by limiting the flow of air or gas between the wafer and bake/chill plate, the distance between the wafer and bake/chill plate determining the amount of flow of air or gas through the flow meter.

REFERENCES:
patent: 3400573 (1968-09-01), Matter
patent: 4142401 (1979-03-01), Wilson
patent: 4607525 (1986-08-01), Turner et al.
IBM Technical Disclosure Bulletin vol. 6, No. 7, Dec. 1963, Fernekees et al.
IBM Technical Disclosure Bulletin, vol. 21; No. 8; Jan. 1979, Benzi et al.

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