Wafer processing method including forming blocking and...

Details Wafer processing method including forming blocking and... Wafer processing method including forming blocking and...

2011-01-04

2011-01-04

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

Reexamination Certificate

active

07863160

ABSTRACT:
A method of processing a wafer having a plurality of devices which are composed of a laminate consisting of an insulating film and a functional film laminated on the front surface of a substrate, along streets for sectioning the devices, comprising a first trip blocking groove forming step for activating a first laser beam application means to form a blocking groove for dividing the laminate along a street of the wafer while moving the chuck table in a first direction in the processing-feed direction; a second trip blocking groove and dividing groove forming step for activating the first laser beam application means to form a blocking groove for dividing the laminate along a street and also to form a dividing groove along the blocking groove formed by the first trip blocking groove step while moving the chuck table in a second direction in the processing-feed direction.

REFERENCES:
patent: 7772092 (2010-08-01), Iizuka et al.
patent: 2005-142389 (2005-06-01), None

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