Wafer processing machine and a processing method thereby

Details Wafer processing machine and a processing method thereby Wafer processing machine and a processing method thereby

1999-03-04

2000-07-25

Banks, Derris H.

Abrading

Abrading process

Combined abrading

451 44, 451262, B24B 100

Patent

active

06093087&

ABSTRACT:
The invention relates to a sheet feeding type wafer polishing machine which processes both surfaces of the wafer and outermost periphery of the wafer (edge part) in series, having two platens which are adhered to a polishing pad or a grinding stone and holding a wafer therebetween. The surface of the wafer is processed by rotating at least one of the two platens and wafer, wherein the diameters of the platens are bigger than the radius of the wafer and smaller than the diameter of the wafer, and the wafer is supported by at least three guide rollers which contact to the outermost periphery of the wafer. The present invention also provides an edge polishing and a surface polishing method which are carried out by the wafer processing machine.

REFERENCES:
patent: 4344260 (1982-08-01), Ogiwara
patent: 4393628 (1983-07-01), Ottman et al.
patent: 5289661 (1994-03-01), Jones et al.
patent: 5486134 (1996-01-01), Jones et al.
patent: 5725414 (1998-03-01), Moinpour et al.
patent: 5755613 (1998-05-01), Uchida et al.
patent: 5868857 (1999-02-01), Moinpour et al.
patent: 5944584 (1999-08-01), Toyama

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