Wafer processing machine

Details Wafer processing machine Wafer processing machine

2006-04-04

2006-04-04

Nguyen, Dung Van (Department: 3723)

Abrading

Machine

Combined

C451S288000, C451S057000

Reexamination Certificate

active

07022000

ABSTRACT:
A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.

REFERENCES:
patent: 6159071 (2000-12-01), Koma et al.
patent: 6379230 (2002-04-01), Hayashi et al.
patent: 6431964 (2002-08-01), Ishikawa et al.
patent: 6500051 (2002-12-01), Nishi et al.
patent: 6527627 (2003-03-01), Arai
patent: 6582287 (2003-06-01), Sasayama
patent: 6780091 (2004-08-01), Mizomoto et al.
patent: 6846224 (2005-01-01), Ki
patent: 2000-254857 (2000-09-01), None

Affiliated with

Also associated with

Rating

Wafer processing machine does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer processing machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer processing machine will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3544846