Wafer processing film

Details Wafer processing film Wafer processing film

1988-05-26

1990-05-29

Buffalow, Edith

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51DIG22, 51DIG27, B24B 100

Patent

active

049284380

ABSTRACT:
This invention provides a wafer processing film comprising a base film having a Shore D hardness of 40 or less and an adhesive layer disposed on one surface of the base film. In grinding the surfaces of wafers such as silicon and similar wafers, breakage can be prevented by affixing the wafers to the adhesive layer of the processing film and then grinding them.

REFERENCES:
patent: 4311759 (1982-01-01), Glennon
patent: 4312916 (1982-01-01), Kakumaru et al.
patent: 4395451 (1983-06-01), Althouse
patent: 4756968 (1988-07-01), Ebe et al.
Technical Update, "B-Stage Epoxies" 3-86, Grace Co.

Affiliated with

Also associated with

Rating

Wafer processing film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer processing film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer processing film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-512563