Coating apparatus – Gas or vapor deposition – Multizone chamber
Patent
1991-05-17
1993-11-09
Thomas, Tom
Coating apparatus
Gas or vapor deposition
Multizone chamber
118722, 118725, H01L 2100, H01L 2102, C23C 1600
Patent
active
052598810
ABSTRACT:
A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, handling and processing of wafers in the machine can occur while other wafers are being preheated. The preheat module has a vertically moveable rack and is loaded with various sized batches of wafers with no vacant positions between them. Wafer shaped shields may occupy positions adjacent top and bottom wafers to cause them to heat the same as other wafers in the rack. Infrared lamps positioned outside of quartz windows heat wafers in the preheat module. The rack may rotate to improve heating uniformity. Temperature sensors, such as pyrometers, that do not contact the wafers being preheated, measure temperature for control of the heating of the lamps.
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Watanabe, T. et al., "Radiation Thermometry of Silicon Wafers in a Diffusion Furnace for Fabrication of LSI", IEE Transactions Transactions on Semiconductor Manufacturing, Feb., 1991.
Edwards Richard C.
Ishikawa Hiroichi
Kolesa Michael S.
Everhart B.
Frei Donald F.
Materials Research Corporation
Thomas Tom
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